Hi, Everyone,

I plan to use some kind of polymer (prefer Teflon) to
cover my device surface as a passivation layer. The
trench I need to fill is about 6-10 um. I want to have
a flat surface after spin-on this passivation layer
and still cover the trench very well. Does anyone has
the similiar experience before. And could you please
recommend me some kind of polymer with can be used
here (prefer temperature no higher than 250C) ? And I
also perfer not to have the CMP process after the
spin-on coating. Please let me know the vendor name
too.

Thank you for any related advice !

Sincerely,
Bert Liu
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