Hello everyone,

I wonder if any readers could offer their advice on the following requirement:

  BPSG deposition at >> 280 angstroms/minute, with ~10% wafer-to-wafer thickness
  uniformity and ~5% within-wafer thickness uniformity on batches of 50 100mm
  wafers.

Any opinions or pointers on how this might be or is being done?

With Regards,

Cam Sorlie


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