HI, Kirt,

Thank you very much for your valuable advice.

Bert

--- [email protected] wrote:
> > I plan to use some kind of polymer (prefer Teflon)
> to
> > cover my device surface as a passivation layer.
> The
> > trench I need to fill is about 6-10 um. I want to
> have
> > a flat surface after spin-on this passivation
> layer
> > and still cover the trench very well. Does anyone
> has
> > the similiar experience before. And could you
> please
> > recommend me some kind of polymer with can be used
> > here (prefer temperature no higher than 250C) ?
> And I
> > also perfer not to have the CMP process after the
> > spin-on coating. Please let me know the vendor
> name
> > too.
>
> Try Futurrex at http://www.futurrex.com/
> They make some positive and negative photoresist
> and spin-on planarization layers.
> I have seen some amazing SEMs of a spin-on layer
> over DRIE trenches.
> I have not used the products myself, however.
>
>       --Kirt Williams Agilent Technologies
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