Hi Kaushik,
           We have also been doing backside alignment
here at the Louisiana Tech and we have been pretty
successful at it. It all depends on the feature sizes
you have. We use the EV 420 Aligner to do the backside
alignment using alignment marks on the front side and
the backside, about 500 microns in length. You could
make it smaller, if you have smaller feature sizes.You
could contact me is you have specific Q's.
Rohit Srivastava
IfM
Louisiana Tech Univ,
Ruston, LA 71272
--- Kousik Sivakumar  wrote:
> Hi,
> I am trying to get a through-hole in a Si wafer. I
> would like to know how
> to perform alignment for the front and back side of
> a wafer. I have not
> been able to align the two squares on either side of
> the wafer accurately.
> Any suggestion regarding this will be really
> helpful.
> Any suggestion for forming a through-hole without
> having to make two
> squares on either side of the wafer will also be
> helpful.
> Thanks
>
> Kousik Sivakumar
> Graduate student
> Department of ECE
> University of Delaware
> Home: 302-737-5232
> E-mail: [email protected]
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