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MEMSnet Home: MEMS-Talk: RE: Looking for Wafer Sawing & Die Bonding and other MEMS foundry services
RE: Looking for Wafer Sawing & Die Bonding and other MEMS foundry services
2002-09-04
Ping Li
Wafer saw modifications
2002-09-05
RobDavis
2002-09-09
shay kaplan
RE: Looking for Wafer Sawing & Die Bonding and other MEMS foundry services
Ping Li
2002-09-04
The following brief list of current available MEMS Foundry Services provided
by Parvenu will answer Amit's questions and as well as others who are
looking for MEMS development and fabrication services. We are located in
southern California. Please contact me to discuss your requirements. Thanks.

>Amit Shiwalkar wrote: Dear All,

>Can anyone suggest any vendor for, Wafer Sawing ( 6" / 8" Silicon wafer)
>and Die bonding service,
>for Aluminum pads, located in southern / northern california.
>A vendor who does doing prototyping or small volume work is preferable.

>Thanks in advance.
>Amit Shiwalkar



Parvenu’s (SMT) Micro Fabrication Foundry Services

Parvenu’s (formerly Solus Micro Technologies, Inc. or SMT) Process Lab is a
member of fabrication provider of MEMS-Exchange. In addition to services
provided through MEMS-Exchange, we also directly provide customers with
micro fabrication services from single step wafer fabrication to complete
process development for MEMS, MOEMS or micro fluidic devices. Current
available services are as follows.

Substrate
·       Silicon wafer
·       Glass
·       Quartz.

Unit Process
·       Photolithography with front-front and front-back alignment capability
·       Lift-off process for Aluminum, Gold, multi-metal layers and dielectric
materials from 0.2 to 15 micron
·       Deposition by E-beam evaporation with either dome or rotating orbital
wafer mounting.
o       Al              0.01 - 5 micron
o       Ag              0.01 - 1 micron
o       Au              0.01 - 1 micron
o       Cr              0.01 - 0.1 micron
o       Ni              0.01 - 1 micron
o       Nichrome        0.01 - 0.5 micron
o       Ti              0.01 - 0.1 micron
o       Dual metal layers
o       Tri-metal layers
o       Etc.
·       Deposition by sputtering.
o       Ag
o       Au
o       Cr
o       Ni
·       PECVD silicon nitride deposition
·       Reactive Ion Etch (RIE) for silicon nitride, silicon oxide, etc.
·       Deep Reactive Ion Etch (DRIE) for silicon
·       Wet etch for silicon and glass wafers
·       Dicing
·       Solder die bonding
·       Wafer mounting

Ping Li
Manager of Process Lab
Parvenu, Inc.
A Wholly Owned Subsidiary of N. P. Photonics
5706 Corsa Ave.
Westlake Village, CA 91362
818-991-7044 Ext. 218
818-991-7128 (Fax)
mailto://[email protected]
http://www.solustech.com





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