Hi all,

    I am doing gold electroplating on a 2 inch x 2 inch
ceramic with 50nm/100nm Ti/Au seed layer and a magnetic
strring is added. I set the current to 80mA and it takes
13mins to plate up to 3um. However, I found that the
uniformity was very poor. The gold thickness at the side of
the ceramic is 4-5um while the center is 3um. I would like
to ask what causes this non-uniformity and how to improve?