Magnetic stirring is not a good way to agitate a gold plating solution.  If
you have a laminar flow accross the substrate, the plating solution can
become depleted as it moves accross the subtrate, leading to thicker
plating.
Other agitation methods are hand agitation (which is a pain), or bubbling
dry N2 through the solution.

David Nemeth
Senior Process Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
Ph: (703) 961-9573 x206
Fax:(703) 961-9576

-----Original Message-----
From: [email protected] [mailto:[email protected]]On
Behalf Of Kin
Sent: Tuesday, September 17, 2002 4:16 AM
To: [email protected]
Subject: [mems-talk] How to improve electroplating uniformity?


Hi all,

    I am doing gold electroplating on a 2 inch x 2 inch
ceramic with 50nm/100nm Ti/Au seed layer and a magnetic
strring is added. I set the current to 80mA and it takes
13mins to plate up to 3um. However, I found that the
uniformity was very poor. The gold thickness at the side of
the ceramic is 4-5um while the center is 3um. I would like
to ask what causes this non-uniformity and how to improve?

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