> I would like to bond Si and pyrex wafer together by anodic
> bonding.  My Si wafer has some trenches which the bottom is
> covered by a 200A Cr/ 500A Au.  How can I clean this Si wafer
> before anodic bonding?  Can I do RCA SC1 clean
> (water+H2O2+Ammonia solution) to remove organic
> contaminations, without the RCA SC2 clean (water+H2O2+HCl),
> which remove the metallic contaminations?

You can do a Piranha clean (H2SO4 + H2O2, 120 C) for 5 minutes.
In our experiments with different gold samples (with chromium adhesion layer),
one was not etched at all and the other was roughened slightly.

        --Kirt Williams Agilent Technologies