The best method would be to do a native oxide removal in vacuum prior to gold
deposition. Most sputtering systems have an rf section when used with argon
will remove the native oxide and promote better adhesion. Another method
would be to use a plasma asher or stripper prior to evap. This method will
remove any organic contamination that might be on the surface. If you have a
plasma system available you might also want to terminate the surface with
hydrogen prior to evap. Hold the bare wafer over concentrated HF solution and
allow fumes to remove the oxide. Put into your system immediately as the
hydrogen terminated surface should protect the native oxide from instant
regrowth which is why most people do it in a vacuum. Good luck. Bob Henderson