> -----Original Message-----
> From: tram x [mailto:[email protected]]
> Sent: Wednesday, November 13, 2002 9:21 AM
> To: [email protected]
> Subject: [mems-talk] HF-vapor etch cleaning
>
> Can somebody explain me of how the cleaning is made after etching in
> HF-vapor phase? Since sticking wants to be avoided i guess that water
> cleaning cannot be made. Is there some water vapor cleaner inside the
> system?

After I do HF+H2O-vapor etching, I just put the wafer on a hot plate
at 150-200 C for 15 minutes. As both HF and H2O are volatile
(pure HF boils just above room temperature), I figured that this would be
sufficient and I have not noticed any problems.

        --Kirt Williams Agilent Technologies