Jeff:

You can try crystal bond of a glass wafer to protect the membranes and
dismount them in acetone after dicing, if the cost is not a concern.  Our
devices with membranes all survived dicing this way.

Haqing Li


At 10:44 AM 11/22/02 -0500, you wrote:
>We have developed a MEMS based microphone that will be used in the cell
>phone industry.  One of the problems we have run into is in the dicing
>process.  The membranes on the chip are very fragile and can very easily
>damaged.  We can't use tape directly on the chips and water would hurt
>them.  We are experimenting with using two layers of tape with the first
>layer having holes punched out where the membranes will be and the
>second layer forms a tent over them.  With this process the membranes
>will never touch the tape.
>If there is anyway your company could help us we'd appreciate any ideas
>and would enjoy working with you.
>
>Thank you,
>
>Jeff Hibner
>Akustica Inc.
>2403 Sidney Street
>Pittsburgh PA 15203
>Phone 412-390-1730
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===========================================
Hanqing Li, Ph.D.
Research Scientist
Massachusetts Institute of Technology
Microsystems Technology Laboratories
Phone: (617)-258-5920,  Fax (617)-258-5940
===========================================