Dear all,

I would like to know if there exists a process for electroless copper
deposition that will only deposit copper on copper that is already there or
on specially treated surfaces (e.g. palladium activated). More specific: I
have a tungsten surface next to (in electrical contact with; don't know if
that's important)  a copper surface. I would like to deposit copper on the
copper surface only, without having to mask the tungsten. A highly reduced
deposition rate on tungsten would also be acceptable because a short Cu-etch
after deposition would remove the excess Cu from the tungsten.
I would be grateful for any response.

Best regards,

Gilbert Schuurman


Viasystems Mommers B.V.
Peutenweg 2
6101 VZ Echt
The Netherlands
tel. : +31 475 479-222
fax: +31 475 479-407
mailto:[email protected]
http://www.viasystems.nl