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MEMSnet Home: MEMS-Talk: 3D-CSP
wafer cleaning
2002-12-18
foo foo
2002-12-18
Mark West
2002-12-18
Luesebrink Helge
3D-CSP
2002-12-19
Andrea Reinhardt
2002-12-18
[email protected]
2002-12-18
[email protected]
3D-CSP
Andrea Reinhardt
2002-12-19
to everybody requested for 3D-CSP presentation on CD and provided his/her
mail adress:
packages left our office yesterday, tmerry christmas and happy new year

p.s. if you are located in Florida and want to pose your questions directly,
meet microTEC at:
Machines and Processes for Micro-scale and Meso-scale Fabrication,
Metrology,
and Assembly, Wednesday - Thursday, January 22-23, 2003
J. Wayne Reitz Union, University of Florida, Gainesville, Florida
http://www.doce-conferences.ufl.edu/ASPE/

Growing Up, Additive Processes in MEMS Fabrication and Packaging

The most important growth factor in nature is light. Its secrets have been
the basis of several technological revolutions. Growth through light is the
paragon of generative technology. Light can not only be used for the
polymerization of organic materials, but also for the structured growth of
inorganic structures. Thus, light provides us with an ideal and cheap tool
for production. For the production of MEMS, we need the capability to
combine organic and inorganic materials with their different properties in
the smallest possible space. The mechanical, electrical, optical, chemical
and biological functions can be deposited from the gaseous or liqued state
with nanometer scale accuracy according to the desired property using light.

Today, the question posed by Richard Feynmann at the annual meeting of the
American Physical Society at the California Institute of Technology: "Is
there a physical process for the synthesis of any arbitrary chemical
substance?" can be answered with "yes". The relevant physical processes span
a range from the well-known photopolymerization process to the deposition of
molecules induced by focused electromegnetic radiation and the two-photon
process for polymerization.

An important condition for the economic application of these processes is a
build-up rate appropriate to the desired volume, or, figuratively put,
"small bricks for small houses and big bricks for big houses". Also of
importance is the compatibility fo the physical processes and conversion to
a batch (large-scale, mass-production) process. The RMPD technologies have
combined these principles, offering the possibility of the integration of
electronic parts using 3D-CSP, the integration of electrical, optical
biological and chemical functions using RMPD-multimat while possesing a
build-up rate appropriate to the volume scale.



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