Hi all,

Could anyone recommend a dicing saw blade or blades suitable for cutting
the following combinations of materials:

Silicon (0.5mm thick) anodically bonded to Pyrex (0.5mm thick)

Pyrex (0.5mm thick) spin coated with a 5 micron layer of SU 8

Silicon (0.5mm), with an electroplated Copper layer (0.4mm), topped with a
5 micron thick SU 8 layer and a 0.5mm Pyrex layer.

Thicknesses are approximate at the moment, but the maximum depth to which
I'll be cutting will be < 1.5mm

The thickness of the blade doesn't matter to me as there is plenty of room
between samples, though the more vertical the cut edges are the better.
Thanks in advance for all assistance.
--

Regards,
Cormac Eason