Stefan,
       I would think metal lift off which should be easy, repeatable and is
capable of critical dimensions down to 0.1 micron with repeatable ease.  No wet
etching and no plasma etching which can be a pain when exotic gasses are
required.  if you need technical papers on lift off let me know.  Bill Moffat

-----Original Message-----
From: Stefan Junge [mailto:[email protected]]
Sent: Wednesday, January 15, 2003 7:01 AM
To: [email protected]
Subject: [mems-talk] Dry strukturing of tungsten with PR as mask


Dear all,

i want to structure tungsten dry with PR as masking layer.
Does anybody have experiences on etchrates, selectivities
to SiO2. I thought about CH4, SF6 or Ar as gases.

Regards,

Stefan Junge


--
Institute for Microsensors, -actuators and -systems (IMSAS)
University of Bremen
Stefan Junge (Ph.D student)
Dep. 1: Physics/Electrical Engineering
Otto-Hahn-Allee
28359 Bremen, Germany

P.O. Box 330 440
28334 Bremen, Germany

Tel.: +49-421-218-3586
Fax.: +49-421-218-4774
E-Mail: [email protected]
Internet: www.imsas.uni-bremen.de

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