Dear Colleagues,

Am searching for practical information / experience on sputtering metallization.
I'm using SOI wafers and i tried to have Cr/Pt/Au contacts on Si. After
sputtering, I did a post bake and I had a long HF 48% attack. It look like an
etch under contacts.
Does anybody know this problem and how to avoid it?
Any experiences, information, recipes, etc would be greatly appreciated.

Best regards,

Benoît GAULIER.

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   Benoît GAULIER
   Ingénieur Filière Microtechnologie
   THALES AVIONICS
   NAVIGATION
   25, rue Jules Védrines 26027 Valence CEDEX
   Télécopie: (+33) (0) 4-75-79-86-06
   Bureau: (+33) (0) 4-75-79-88-25
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