Hi all,

I'm currently investigating processes for making microchannels by Electroplating
copper. One method I came across used a silicon mould which was then plated over
by copper to form a copper block with the inverse of the mould geometry on its
surface.

I'm wondering how the copper was seperated from the silicon. Is there a layer or
surface treatment which can be used? If a photoresist is being used, is there a
standard method available to coat it evenly over the mould before the seed layer
is evaporated on? Can a reasonably even layer be deposited by dipping the mould
in resist and leaving excess resist to drip off before baking?

All help would be greatly appreciated.

Regards,

Cormac Eason.