Dear Anna-Sara,

We provide ultrasonic milling services.We would be glad to help you. What is
the diameter
of the hole. You can contact me at [email protected].

                                                           Sincerely,
                                                                      Steve
Pence

Formatrix inc

408-980-9324


----- Original Message -----
From: "Anna-Sara Hedman" 
To: 
Sent: Wednesday, November 27, 2002 6:41 AM
Subject: [mems-talk] Through holes (vias) in quartz glass 4 " wafer?


> Dear Sir/Madam,
>
> Do you know how to make via holes - i.e. holes through
> a quartz glass (fused silica) 4 " wafer, 525 microns thick?
>
> Or do you know anybody else who can do this (in Europe if possible?)
> by laser or ultrasonic drilling? Or any other technique?
>
> I need to have approx. 160 holes in each wafer.
> The wafer is covered with photoresist (or other masking material)
> to mark the location of the through holes,  but also to protect
> the bonding surface on the other side from mechanical scratch ...
> The hole location is quite important...
>
> I'll  be happy to hear from you soon !
>
> Thanks!
>
> Best regards
> 
>
>
>
>
>
>
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/
>