Dear folks,

I have a problem with above bonding, i.e., ceramic is bonded with another
substrate using polymer as intermediate layer.  There is no voids after bonding,
but a lot came out after reflow process that at 230 degC.  It seems ceramic that
gives the problem.  I appreciate it very much if anybody could comment it.

Thanks & best regards,
Kasey Ma
Agilent Technologies Singapore