Graham,
       Candescent a company that went under during this down turn used a lot of
my companies equipment for dealing with glass frits.  They used surface tension
modification equipment, both plasma to move the contact angle close to zero and
silane depositing equipment to move the contact angle up towards 100 to match
liquid photo resist surface tension for bonding photo resist.  They also used
high temperature 450 degree high vacuum 10(-7) to seal the frits in a high
vacuum.  I will try to locate the one extremely knowledgeable Candescent
engineer I think I can find for info.  You may wish to start this search too.
Bill Moffat.

-----Original Message-----
From: Graham Tomblin [mailto:[email protected]]
Sent: Tuesday, February 04, 2003 11:38 AM
To: [email protected]
Subject: [mems-talk] GLASS FRIT BONDING PIEZORESISTIVE SEMICONDUCTOR
GAGES TOST ST


Does anyone know of a technique for bonding piezo-resistive strain gages to
stainless steel using glass frit?.
Types of glass, gages, wire bonds and process definition  would be a great help.
Regards
 Graham



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