It sounds like gas production during high temperature bonding.  I suggest a
partial vacuum heated gas process to allow bonding but continuous removal of the
generated gas.  Bill Moffat

-----Original Message-----
From: [email protected] [mailto:[email protected]]
Sent: Monday, February 03, 2003 11:14 PM
To: [email protected]
Subject: [mems-talk] ceramic bonding using polymer as intermediate layer


Dear folks,

I have a problem with above bonding, i.e., ceramic is bonded with another
substrate using polymer as intermediate layer.  There is no voids after bonding,
but a lot came out after reflow process that at 230 degC.  It seems ceramic that
gives the problem.  I appreciate it very much if anybody could comment it.

Thanks & best regards,
Kasey Ma
Agilent Technologies Singapore

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