Hi,

Does anybody has experience of how to bond SOI wafer to glass wafer using
anodic bonding?
Our SOI wafer is about 175-450 micron Si, 1 micron Oxide and 1 micron Si p+.
The interface bonding layer would be the 1 micron Si p+ layer on SOI wafer
with another glass substrate. Your response would be appreciated.

Thank you.

A.K.Ismail