i tried die attach + wire bond of MUMPS die onto PCB
die attach using thermal cure epoxy (AMICON)
after cure, some die exhibit "thermal stress"---> cantilever becomes more
curling upward.
please suggest way to overcome it (ie. different epoxy, other bond
material )

i suspect curing time should affect this, but i don't have enough chip to
test out all timing spec.

Leow
Universiti Teknologi Malaysia, Malaysia