I had the same resist adhesion problem on Pyrex.  The solution I came up
with was to evaporate or sputter layer of Cr on the Pyrex prior to applying
resist.  The Cr can then be etched with Transene Chrome Etch before etching
the Pyrex in BOE.  This was apparently not a complete fix, since a 5 micron
etch depth in the Pyrex resulted in the Cr being undercut ~20 microns.

The undercut problem can be eliminated by plasma etching the Pyrex. However
the etched surface may be too rough for your subsequent metalization.

Roger Shile

----- Original Message -----
From: "Sang Hwui Lee" 
To: 
Sent: Wednesday, March 05, 2003 9:11 AM
Subject: [mems-talk] Pyrex glass etching


> Hello,
>
> I would like to etch pyrex glass with ~5x6 mm2  and 2um deep. I have tried
> to use BOE(6:1) solution for pyrex glass with thin photoresist(~1um),
> however. photoresist started to peel off and be bubbled  in between
> interface after 1hr. so, glass is etched in unwanted area. do you have any
> idea for it? I need it to have a little bit slope on the edge because Al
> eletrode should  be deposited on cavity and non-cavity area, which means
it
> should be a step coverage continuously after etching. after all these
steps,
> this glass wafer will be wafer bonded to Si wafer, which means the surface
> of glass should be very smooth.
>
> thank you,
>
> SangHwui Lee
> Ph.D candidate/MSE/NJIT
> Microelectronics Research Center(MRC)
> 973-596-6368(O)
> 201-242-1486(H)
>
>
>
>
>
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