Dear All,
    I am using a type of epoxy adhesive to adhere my chip to the holder.
However,
after the adhesive is solidified, there are a lot of internal stress which
influences the performance of the device badly.
    I wonder who can tell me how to minimize this negative effect,
selecting a
higher capable adhesive, or using some aftertreatments during and after the
solidification?
    Thank you!

Xiaotong Gao






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