Dear Ms. Carlo:

Apparently there was a problem with the server; the paper was not available and
the presentation was an old version.  The paper and the correct presentation
have been reload and are now available.

Sorry for the inconvenience,

Mac Daily

Mac Daily wrote:

> Dear Ms. Carlo:
>
> Brewer Science is developing a material that meets your description: a spin
> applied material, cured at under 250 degrees Celsius, able to withstand 8 or
> more hours of 85 degree Celsius KOH (35%).  This material is removed with
> standard photoresist removal process.  If you go to our web site you can see
> the paper presented on this material at Photonics West 2003.  (See "Etch
> Protective Coating Paper" http://www.brewerscience.com/sm/sm_tech_info.html)
> Our test results are being verified at several independent facilities and the
> application process is being optimized.  This material will be available for
> sampling this summer.
>
> Best Regards
>
> Mac Daily
>
> [email protected] wrote:
>
> > dear all,
> > can you suggest a good organic material, depositable or spinnable at low
> > temperature, to be used as a protection mask for long KOH etching process?
> > ...... it should be lifted-off or etched easily in a chemistry which do
> > not affect SiN layers.
> > thank you for any help you can provide
> >
> > carlo
> >
> > _______________________________________________
> > [email protected] mailing list: to unsubscribe or change your list
> > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> > Hosted by the MEMS Exchange, providers of MEMS processing services.
> > Visit us at http://www.memsnet.org/
>
>   ------------------------------------------------------------------------
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/