My experience with electroplating is that increased current density will
increase PR cracking.  Try reducing the current density. Good luck.

-Jonathan Engel
MASS Group UIUC
http://mass.micro.uiuc.edu

>----- Forwarded Message -----
>From: "Park, Sang Won (Daniel)" 
>To: General MEMS discussion 
>Subject: [mems-talk]  What is the best first layer for the multi-layer
process?
>
>Hi, all.

>But when I finished the plating with first PR layer mold, I noticed very
>small cracks in the resist. Those cracks made problems after I applied SJR
>5740 with seed layer on it. Such cracks got bigger and bigger so that they
>made another problems (e.g. shorting metal lines) to the second
>electroplated structures.