> I want to sputter Gold, Chromium or Aluminium
> nearly stress free ( between 0 MPa and 20 MPa ).
>
> Can anybody tell me, if it's possible and where can
> I find more information about it?

Stefan,
I have some company internal papers (the ex MRC Sputter School)
that explain the concept, but I can't give away. Can you give me
a fax number so I can at least send you a summary chart of which
sputtering process parameter changes stress in which way.

The short version is that you're probably out of luck, as
all the films you want to use will be tensile under any reasonable
conditions, Unless resistivity is absolutely no concern, then you
could try RF bias.

The only reasonable way to get a nearly stress-compensated
stack is to use one (usually the barrier/adhesion) metal that can
be deposited compressive with good quality. TiW and TiN
are common choices.

best regards,
klaus


--
(TEL) Tokyo Electron Europe Limited     SD BU Process Manager
Klaus Beschorner                           Tel +49-7033-45683
Drosselweg 6                               Fax +49-7033-45631
71120 Grafenau, Germany               Mobile +49-174 315 7754