Due to the low pressure and lack of gas phase scattering, evaporation tends
to be directional and result in poor sidewall coverage.

Sputtering the Au, should give you better sidewall coverage, particularly at
higher pressures.

Roger Shile

----- Original Message -----
From: 
To: 
Sent: Monday, March 10, 2003 3:44 PM
Subject: [mems-talk] Deposition of Au into a microchannel


>
> Hi all,
>
> I am trying to deposit Au layer on the surface of a microchannel, both the
> walls and the bottom.  However, by evaporation the gold only deposits at
the
> bottom surface;  the walls of the channel are not covered.  I am wondering
if
> someone has experience solving this problem.
>
> Thanks alot!
>
> Zhiyu
>
>
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