Evaporation is mostly line-of-sight from the source.
The bottoms of your channels are facing the source,
so they receive most of the flux, while the sidewalls receive little.
I don't know what kind of fixutures you have available,
but if you tilt the wafers slightly, more gold-atom flux will hit the sides.
If you tilt too much, no gold will hit the bottom.
The maximum tilt allowable depends on the channel aspect ratio.
A planetary-type fixuture will give a uniform thickness on both sides of the
wall.

Another option is sputtering from a large gold target. In this case,
gold atoms will eminate from all over the target, and travel in different
directions,
coating both sidewalls and bottom.

        --Kirt Williams, Ph.D., consultant

> -----Original Message-----
> From: [email protected] [mailto:[email protected]]
> Sent: Monday, March 10, 2003 3:44 PM
> To: [email protected]
> Subject: [mems-talk] Deposition of Au into a microchannel
>
>
>
> Hi all,
>
> I am trying to deposit Au layer on the surface of a
> microchannel, both the
> walls and the bottom.  However, by evaporation the gold only
> deposits at the
> bottom surface;  the walls of the channel are not covered.  I
> am wondering if
> someone has experience solving this problem.
>
> Thanks alot!
>
> Zhiyu
>
>
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