Shweta,

I will not worry about survival of 1813 in HF. Instead, I'll pay attention
to photoresist peel off from the substrate.

Jing Liu

----- Original Message -----
From: "Shweta Humad" 
To: 
Sent: Friday, March 14, 2003 11:16 AM
Subject: [mems-talk] HF attack of PR Shipley 1813


> Hi all,
> I was thinking of a process which would involve a last step of HF wet
> etching to create 4 micron deep trenches in silicon. I'm not sure how
> long the photo resist can withstand the HF. The photo resist would be
> Shipley 1813. I could use BOE also instead of HF but that would take
> even longer. Has anyone does this before?
>
> Thank you
> --
> Shweta Humad
> Office: (404) 385-4306/2400
>
>
>
>
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