Dear Mark,

Please see http://www.evgroup.com/products/inspection.htm

The EVG40 measurement system performs precision destruction-free top-to-bottom
side alignment accuracy measurement of double-sided structured wafers. The EVG40
system surpasses the limitations of conventional double-view microscopes and
infrared systems, which rely on a complicated and time consuming procedure to
calibrate optical axis.

Best regards,
Helge



-----Original Message-----
From: Mark van der Heijden [mailto:[email protected]]
Sent: Wednesday, March 19, 2003 8:32 AM
To: [email protected]
Subject: [mems-talk] Overlay between front and back of wafer



Hi All,

Does anyone know of a method/device to measure which i can use to measure
the overlay between structures on the front and the back of a wafer.

Thanks,
Mark




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