Etching another microchannel on a facet of a
largerexistingmicrochannel
Michael D Martin
2003-03-19
If you want to write on the side of the trench such as the (111) plane
of a (100) wafer you might consider using an excimer laser machining
system to either ablate or expose a resist layer. You would presumably
have to spray or dip coat your sample. There are a number of job shops
you can contact for this service, e.g. www.jpsalaser.com
-Mike Martin
>>> [email protected] 03/18/03 12:00PM >>>
Danny,
Complex answer. Using image reversal and a 3D holographic
aligner I have seen 0.1 micron geometry on the side walls and the bottom
of an etched trench. I can reach the original engineer for more
information if you want to follow up. Bill Moffat
-----Original Message-----
From: Danny Klein [mailto:[email protected]]
Sent: Monday, March 17, 2003 5:02 AM
To: [email protected]
Subject: [mems-talk] Etching another microchannel on a facet of a
larger existingmicrochannel
Hello mems-talk members,
I'm trying to establish a way to etch a few long parallel
micro-channels on a facet of a larger existing microchannel.
If someone knows of a way to manufacture according to that idea or have
seen an article dealing with that idea please let me know.
Thank you in advance,
Danny Klein.
-----------------------------------------------------
Danny Klein
Department of Mechanical Engineering
Technion, Israel Institute of Technology
Haifa, 32000
Israel
Tel (Lab.): 972-4-8292946(3861)
Email: [email protected]
-----------------------------------------------------
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