Kirt and Erika,

Thank you for your advice. However, I don't think it is the undercutting
problem. I use 10nm-thick Cr while width of pattern is 20 um. Even if it's
undercut, the pattern should left, not disappear like this.

Now, I suspect the adhesion problem between Cr and Au. Is it possible that
the adhesion is poor in some conditions of deposition (E-beam evaporator)
such as not low enough pressure or too low temperature (at wafer holder
because cooling water)?

Does anybody has Cr/Au/Cr deposition recipe or any suggestions about
Cr/Au/Cr deposition?

Thank you in advance

Alongkorn Pimpin