Hi folks,

Does anyone has the experience in thin wafer(<200um) bonding to thick wafer
(>525um) and debonding (Si to Si)?
I have tried PR and thermal release tape as adhesive, but the results were
not good.
During the release process, the device thin wafer might have residue of the
adhesive or even damaged.
I need some kind of adhesive that can survive at temperature 120C, 2 min in
lithography and debond easily and cleanly.
If you have any suggestions, please let me know.
Thanks a lot.

 Best Regards,

Weider Welson Tang
                     Engineer
                     Walsin Lihwa Corp.
                     Manufacturing Partner Service Center
                     Technology Development Division
                     Micro Tech. Development Dep.
                     Tel : 886 - 3 - 2889422 ext. 8238
                     Fax : 886 - 3 - 2889435
                     E-mail : [email protected]