Dear Mr. Tang:
You may want to try Brewer Science's PiRL III. We have demonstrated PiRL's
use for temporary wafer to wafer bonding in our laboratories. Please visit
our web site http://www.brewerscience.com/smproducts/sm_rel_sacrif.html to
read a summary on PiRL III. If you then click on Technical Information, you
can down load a data sheet under the Protective/Barrier Coating heading. You
can also down load a presentation on PiRL III under the heading of Product
Presentations and Overviews. This includes how we use PiRL III for temporary
wafer to wafer bonding.
As a note, your application requires the adhesion to withstand 120C
temperature and still release. PiRL III will withstand temperatures of 350C
or more and still release.
If you have any questions, please contact me.
Madison Daily
[email protected] wrote:
> Hi folks,
>
> Does anyone has the experience in thin wafer(<200um) bonding to thick wafer
> (>525um) and debonding (Si to Si)?
> I have tried PR and thermal release tape as adhesive, but the results were
> not good.
> During the release process, the device thin wafer might have residue of the
> adhesive or even damaged.
> I need some kind of adhesive that can survive at temperature 120C, 2 min in
> lithography and debond easily and cleanly.
> If you have any suggestions, please let me know.
> Thanks a lot.
>
> Best Regards,
>
> Weider Welson Tang
> Engineer
> Walsin Lihwa Corp.
> Manufacturing Partner Service Center
> Technology Development Division
> Micro Tech. Development Dep.
> Tel : 886 - 3 - 2889422 ext. 8238
> Fax : 886 - 3 - 2889435
> E-mail : [email protected]
>
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