Hello,

We are producing temporary bonding and debonding equipment for the handling of
thinned substrates down to the sub 100micron range.
The bonding platform is capable of using various intermediate substances for the
temporary bond such as wax, resists, thermal release tapes or UV relaease tapes.
The debonding platform has demonstrated to successfully debond such temporarily
bonded stacks consisting of the carrier wafer and the thinned device wafer of
thicknesses  significantly below 100 micron. Depending on the intermediary
substance used for the bond and the device requirements, a cleaning step
subsequent to the debonding process can be implemented in the debonding platform
in an automated way which provides a perfectly clean surface prior to unloading.
Unique, sophisticated handling methods of the thinned wafer after debonding such
as special endeffectors and mounting to carriers used for further processing are
available. These handling approaches ensure that the fragile thinned, debonded
wafer can be handled without breakage or damage.
For further information on the system you can also check out our web site at
www.evgroup.com

For further discussion of your process specifics, you can contact me at +1 602
437 9492. or at [email protected]

Best regards,
Markus Wimplinger

Technology Manager
EVG - Technology US.

-----Original Message-----
From: [email protected] [mailto:[email protected]]
Sent: Mittwoch, 02. April 2003 01:13
To: [email protected]
Subject: [mems-talk] Temperory bonding and debond ?


Hi folks,

Does anyone has the experience in thin wafer(<200um) bonding to thick wafer
(>525um) and debonding (Si to Si)?
I have tried PR and thermal release tape as adhesive, but the results were
not good.
During the release process, the device thin wafer might have residue of the
adhesive or even damaged.
I need some kind of adhesive that can survive at temperature 120C, 2 min in
lithography and debond easily and cleanly.
If you have any suggestions, please let me know.
Thanks a lot.

 Best Regards,

Weider Welson Tang
                     Engineer
                     Walsin Lihwa Corp.
                     Manufacturing Partner Service Center
                     Technology Development Division
                     Micro Tech. Development Dep.
                     Tel : 886 - 3 - 2889422 ext. 8238
                     Fax : 886 - 3 - 2889435
                     E-mail : [email protected]