Martin:

I think your observations have some merit as to the ability to run deep silicon
etches after using the same systems for deep oxide etch. Can you share with the
group if you are talking about only the Bosch process or do you have experience
with other processes for deep silicon etch?

We here at Trion are taking a different approach for etching deep oxide
processes.  We have developed a new electrostatic chuck design that allows us to
effectively clamp quartz and other dielectric substrates. This allows descent
cooling of the substrate during the deep oxide etch process which does not
include an ICP type design. If anyone in the MEMS community would like to know
more about our deep oxide capabilities or would like to run samples at our lab
in Arizona you can contact me directly. Currently most work is being done on
100mm substrates so for the time being we would like to limit to those sizes..

Bob Henderson
Trion Technology
1025 S. 52nd Street
Tempe, Arizona 85281
Phone: 480-968-8818 x 11
Fax: 480-968-8896
web site: www.triontech.com