Hi,

For wafer bonding, we offer a product called PiRL.  You can view at a
presentation for this process at

 http://www.brewerscience.com/sm/sm_tech_info.html

Look under the category, "Product Presentations and Overviews", and click
on PiRL.

The neat aspect of PiRL for this application it that it can be processed
at 300C plus and can still be removed.

Best Regards,
Shane

Imran Ghauri wrote:

> Hi guys,
> As MEMS-talk member I would like to ask few questions.
> I hope you guys will help me.
>
> 1) Is there any way I can attach one Si-wafer on top
> of other OR
> one Si-wafer on top of glass wafer.
>
> 2)I need some help in fabrication of MEMS thermopiles,
> if anyone of you has done it or know about it plz let
> me know so that I can get more info about the same.
>
> 3) How can I create front and back etched vacuum
> cavities in wafers.
>
> Thanks in Advance
>
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