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MEMSnet Home: MEMS-Talk: adhesion problems (Rajib Ahmed)
adhesion problems (Rajib Ahmed)
2003-04-14
Dlee Li
adhesion problems (Rajib Ahmed)
Dlee Li
2003-04-14
Hi,Rajib Ahmed
Maybe you can try O2 plasma surface actuation before you deposit metal. I
try to depoist Gold on polymer or glass substrate. O2 plasma can help
adhesion a lot. But i think the best way is to use some adhesion layer such
as Cr or Ti.The adhesion layer should work very well.

good luck
Dlee
Mechanical Engineering
the Unviersity of Texas At Austin

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>Subject: MEMS-talk Digest, Vol 6, Issue 11
>Date: Fri, 11 Apr 2003 12:00:06 -0400
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>Today's Topics:
>
>    1. RE: Photosensitive passivation layer (Bill Moffat)
>    2. Re: Etching Oxide in deep silicon systems ([email protected])
>    3. RE: Seeking vacuum probe station (Helen Jervis)
>    4. Quartz glass and HRSS wafer requested (Oberhammer Joachim)
>    5. Thickness of polyimide  (aslam muhammad)
>    6. RE: Seeking vacuum probe station (Martin Manscher)
>    7. MOS capacitors in MEMS sensors (Robert Dean)
>    8. Attachment of wafers (Imran Ghauri)
>    9. on-line viscosity sensor (Reiza Zakia Mukhlis)
>   10. job opportunities in MEMS (Qingwei Mo)
>   11. adhesion problems (Rajib Ahmed)
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