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MEMSnet Home: MEMS-Talk: cleaving of ultra-thin Si wafers
cleaving of ultra-thin Si wafers
2003-04-15
Esteban Broitman
2003-04-16
Kenneth Smith
2003-04-17
Mario Robles
2003-04-21
Michael Barger
Photoresist.
2003-04-21
krishna
2003-04-21
Kenneth Smith
2003-04-17
Michael Yakimov
2003-04-18
[email protected]
2003-04-22
Tan Joo Lett
cleaving of ultra-thin Si wafers
Esteban Broitman
2003-04-15
Does anybody know how to "cleave" ultra thin Si wafers?
I need to cut, from ultra-thin (30 microns) Si wafers, substrates of ~
10 x 20 mm. I tried to use different kind of diamonds, but I always have
the same problem: the substrate is not more "flexible", if I try to bent
it, it cracks in many parts. I suspect that I am generating defects
during the cutting of the substrates that propagate during the bending.
Any suggestion?.
Thanks for the reply to my e-mail: [email protected]
E. Broitman
----------------------------------
Dr. Esteban Broitman
Senior Research Associate
Department of Chemical Engineering
Carnegie Mellon University
Pittsburgh,  PA 15213
Phone: (412) 268-9537
FAX: (412) 268-7139
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