I don't know if you have it available, but I would try to use  deep
Si etch.  30 um is not too much, and I would hope you can do this with thick
photoresist, and thin wafer glued with same photoresist on top of the
carrier wafer..


> Esteban Broitman wrote:
> > Does anybody know how to "cleave" ultra thin Si wafers?
> > I need to cut, from ultra-thin (30 microns) Si wafers, substrates of ~
> > 10 x 20 mm. I tried to use different kind of diamonds, but I always have
> > the same problem: the substrate is not more "flexible", if I try to bent
> > it, it cracks in many parts. I suspect that I am generating defects
> > during the cutting of the substrates that propagate during the bending.
> > Any suggestion?.
> > Thanks for the reply to my e-mail: [email protected]
> > E. Broitman
> > ----------------------------------
> > Dr. Esteban Broitman
> > Senior Research Associate
> > Department of Chemical Engineering
> > Carnegie Mellon University
> > Pittsburgh,  PA 15213
> > Phone: (412) 268-9537
> > FAX: (412) 268-7139
>
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