Hello Anupama,
You might want to try Brewer Science's PiRL III. PiRL III is a spin on
polyamic acid that converts to a polyimide form when heated. Like most
other polyimides, PiRL III has excellent high temperature stability,
good resistance to acids and solvents, and good adhesion to
semiconductor substrates. What makes PiRL III unique is its ability to
remain soluble in mild, alkaline media even after very high temperature
processing. We have baked PiRL III at Brewer Science up to 350 degrees
Celsius and have then been successful in later dissolving in it in
positive photoresist developer (i.e. Shipley's MF312). We have had
customers report success at up to 400 degrees Celsuis, but we have not
verified their results. We have also demonstrated in our laboratories
that PiRL III is good for temporary wafer to wafer bonding. To review
the data sheet and the presentation on PiRL III please go to
http://www.brewerscience.com/sm/sm_tech_info.html
Please contact me if you have any questions.
Mac Daily
[email protected] wrote:
>Hi MEMS World,
>
>I was wondering if anyone knows of a high temperature
>adhesive ( upto 400C).
>
>I would like to protect the patterned backside of my wafer
>with a protection (dummy) wafer. The attachement has to be
>done using a high temperature adhesive that will withstand
>upto 400C in a furnace. At the end of my processing sequence
>I need to dissolve the adhesive and remove the protection
>wafer.
>
>If anyone knows of such an adhesive which will not attach
>Polyimide, I would really appreciate if they can share
>their experiences with me.
>
>Sincerely
>Anupama
>
>Anupama V. Govindarajan
>Graduate Student - EE MEMS laboratory
>Department of Electrical Engineering
>University of Washington
>Campus Box 352500, Seattle WA 98195
>Phone: (206)-221-5340
>email: [email protected]
>
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