I am attempting to clear a small inventory of glass, silicon, and SOI wafers
sealed in vacuum packaging from wafer suppliers. The inventory includes

1) Quantity of 10: 6-inch SOI wafers, n-type, (100), 1-10 ohm-cm, 600+/-25
micron thick; 2 micron oxide; 50+/-2 micron thick device layer, n-type,
(100), 1-10 ohm-cm.
2) Quantity of 25: 4-inch, EPI wafers, n/p(100), 1-60 ohm-cm, 395+/-13
micron thick, double side polished substrate;6 micron thick (etch stop
layer), boron/germanium balanced layer, concentration 1.5E+20 cm-3; 25
micron thick structural layer, phosphorous doped to 0.25 ohm-cm,
concentration of 2.0E+16 cm-3.
3) Quantity of 25: 4-inch Pyrex 7740 wafers with flats, suitable for anodic
bonding, double side polished, 500 microns thick.

If you are interested in any or all of these wafers or would like more
information about the wafers, my contact information is Shawn, 719-277-7006,
[email protected].

Thank you.