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MEMSnet Home: MEMS-Talk: cleaving of ultra-thin Si wafers
cleaving of ultra-thin Si wafers
2003-04-15
Esteban Broitman
2003-04-16
Kenneth Smith
2003-04-17
Mario Robles
2003-04-21
Michael Barger
Photoresist.
2003-04-21
krishna
2003-04-21
Kenneth Smith
2003-04-17
Michael Yakimov
2003-04-18
[email protected]
2003-04-22
Tan Joo Lett
cleaving of ultra-thin Si wafers
[email protected]
2003-04-18
Good Afternoon Dr. Broitman:

Thermocarbon manufactures dicing blades and dicing saws. We could test cut
your wafer, free of charge, and provide you with the process used. If you
would like to pursue this, please contact me so that we can discuss it in
more detail.

Irene Miller
Technical Support
Thermocarbon, Inc.
391 Melody Lane
Casselberry, FL  32707
Toll Free: 800-523-1946
Telephone: 407-834-7800
Fax: 407-767-8675

Please visit our website: Click here: TCAR864-1 Dicing
Saw
http://www.dicing.com
This message and any attachment is confidential.
Do not copy or disclose the contents to any other person.
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