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  • Samples of IC packages for MEMS prototypes (Aranburu Inigo)
  • Q: Dry Processing to increase adhesion Cu to Si3N4 (Erik Jung)
  • US Federal Standart 209e (Dimiter Smilenov)
  • Bonding to silicon nitride at a low temperature (Karthik Kadirvel)
  • SiO2 selective etch (B. Upul Heyshan Mendis)
  • Wire Bonding Service (Mighty Platypus)
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Process Variations in Microsystems Manufacturing