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  • RE: Electric breakdown in MEMS air gap (Ralf Longwitz)
  • 3-D Imaging Through Polysilicon (David Schreiber)
  • MOEMS Packaging question (Anthony Sun)
  • piezocofficients of Si(100) along <110> (anant narain)
  • Pyroelectric Device (Daniel McGregor)
  • looking for sources about microwave design & MEMS (杨尊先)
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