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  • ask for the parameters of RIE for SiO2,Si and Si3N4 (ÂÞÔª)
  • TEOS dep foundry (Kenneth Smith)
  • Pad etch (Roger Shile)
  • Surplus SOI/prime wafers for sale (Larissa Schwartz)
  • Ask reference on "wafer bonding with Au thermocompression" (HAN,CHEOL-HYUN (A-SanJose,ex1))
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Harrick Plasma
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Process Variations in Microsystems Manufacturing
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Harrick Plasma, Inc.
Tanner EDA by Mentor Graphics