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  • Control the pore size and layer thickness of porous silicon (Frank Fan)
  • MEMS Packaging (C S Premachandran)
  • TMAH etching (Knut Lian)
  • ISOTROPIC Silicon etching ([email protected])
  • Ultra-thick Electrodeposited Resists (Whye-Kei Lye)
  • Material Properties (Rick Williston)
  • Please suggest Microscope and Camera for MEMS (Ajay Alai)
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