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  • glues for bonding PDMS film and Si wafer ([email protected])
  • Re: Looking for glass paste suppliers (Gabriel, Markus)
  • Re: SOI fabrication (Gabriel, Markus)
  • SIPOS MEMS-talk Digest, Vol 3, Issue 3 ([email protected])
  • Greetings!!!! I Have a Question Regarding The Reaction of BN to S i (Roger Brennan)
  • Dicing Saw Blades (Shay Kaplan)
  • Looking for SOI with thick insulator layer (Binglin Miao)
  • Dicing Saw Blades (David Nemeth)
  • glues for bonding PDMS film and Si wafer (BRIAN DOUGLAS) (2 parts)
  • Dicing Saw Blades (Carl Arft)
  • MEMS in india (Abhinav Bhushan)
  • removeing a negative pr on Si(100) wafer (Kim, Gunwoo)
  • Uniform Teflon coating on Parylene C (Mighty Platypus)
  • photoresist (Shipley series) thinning using low rate oxygen plasma RIE (Wei Wei)
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Process Variations in Microsystems Manufacturing